发明名称 POLISHING APPARATUS, POLISHING METHOD, AND PROCESSING APPARATUS
摘要 Provided are a polishing apparatus and a polishing method, which are enabled to calculate the external diameter of a wound polishing tape on a polishing tape feeding reel or a polishing tape recovery reel before the polishing operation by a simple operation, thereby to calculate the residual or the consumption of the polishing tape from that external diameter. The polishing apparatus comprises a polishing tape feeding reel (46), a polishing head (44), a polishing tape extracting mechanism (G1), and a polishing tape feeding/recovering mechanism (45) for recovering a polishing tape (43) from the polishing tape feeding reel (46) through the polishing head (44). The polishing tape feeding/recovering mechanism (45) includes a motor (Mb) for applying a torque to the polishing tape feeding reel (46) thereby to apply a predetermined tension to the polishing tape (43) passing through the polishing head (44), and a rotation angle detector (REa) for detecting the rotation angle of the polishing tape feeding reel (46).
申请公布号 KR20090065546(A) 申请公布日期 2009.06.22
申请号 KR20097008964 申请日期 2007.10.02
申请人 EBARA CORPORATION 发明人 TAKAHASHI TAMAMI;ITO KENYA;SEKI MASAYA;KUSA HIROAKI
分类号 B24B21/20;B24B21/18;H01L21/304 主分类号 B24B21/20
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