发明名称 COOLING JACKET OF GAS DISCAHRGE PIPE FOR SEMICONDUCTOR EQUIPMENT, AND MANUFACTURING PROCESS THEREOF
摘要 A cooling jacket of a gas discharge pipe for a semiconductor facility is provided to maximize cooling efficiency by contacting a cooling pipe with an outer circumference of the gas discharge pipe. A jacket for cooling a gas discharge pipe cools down the gas generated in a semiconductor facility. A gas induction path(11) is formed along the length direction center of the inner part of the metal jacket and induces the combustion gas. A plasma combustion unit and a gate valve are connected to an inlet(12) and an outlet(13) of the gas induction path through a connector(30). A plurality of cooling paths(20) are punched around the gas induction path. The cooling path is separated from the gas induction path and induces the coolant.
申请公布号 KR100904025(B1) 申请公布日期 2009.06.22
申请号 KR20080116673 申请日期 2008.11.24
申请人 MUN, JE UN 发明人 MUN, JE UN
分类号 H01L21/00;H01L21/02;H01L21/304 主分类号 H01L21/00
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