发明名称 |
COOLING JACKET OF GAS DISCAHRGE PIPE FOR SEMICONDUCTOR EQUIPMENT, AND MANUFACTURING PROCESS THEREOF |
摘要 |
A cooling jacket of a gas discharge pipe for a semiconductor facility is provided to maximize cooling efficiency by contacting a cooling pipe with an outer circumference of the gas discharge pipe. A jacket for cooling a gas discharge pipe cools down the gas generated in a semiconductor facility. A gas induction path(11) is formed along the length direction center of the inner part of the metal jacket and induces the combustion gas. A plasma combustion unit and a gate valve are connected to an inlet(12) and an outlet(13) of the gas induction path through a connector(30). A plurality of cooling paths(20) are punched around the gas induction path. The cooling path is separated from the gas induction path and induces the coolant.
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申请公布号 |
KR100904025(B1) |
申请公布日期 |
2009.06.22 |
申请号 |
KR20080116673 |
申请日期 |
2008.11.24 |
申请人 |
MUN, JE UN |
发明人 |
MUN, JE UN |
分类号 |
H01L21/00;H01L21/02;H01L21/304 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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