发明名称 |
Semiconductor Device and Method of Forming Wafer Level Ground Plane and Power Ring |
摘要 |
A semiconductor die has active circuits formed on its active surface. Contact pads are formed on the active surface of the semiconductor die and coupled to the active circuits. A die extension region is formed around a periphery of the semiconductor die. Through hole vias (THV) are formed in the die extension region. A conductive plane or ring is formed in a center area on the active surface of the semiconductor die. The conductive plane or ring is coupled to a first contact pad for providing a first power supply potential to the active circuits. The conductive plane or ring is electrically connected to a first THV. A conductive ring is formed partially around a perimeter of the conduction plane or ring. The conductive ring is coupled to a second contact pad for providing a second power supply potential to the active circuits. The conductive ring is electrically connected to a second THV.
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申请公布号 |
US2009146297(A1) |
申请公布日期 |
2009.06.11 |
申请号 |
US20070951729 |
申请日期 |
2007.12.06 |
申请人 |
STATS CHIPPAC, LTD. |
发明人 |
BADAKERE GURUPRASAD G.;CAMACHO ZIGMUND R.;TAY LIONEL CHIEN HUI |
分类号 |
H01L23/48;H01L21/44 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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