| 摘要 |
A direct attach interconnect includes a housing and spring contacts. The housing has top and bottom sides lying in parallel planes defined by x and y axes. Passages extend along the z axis between the top and bottom housing sides. Each spring contact has a middle portion and top and bottom ends. The spring contacts are individually disposed within respective passages such that the top ends of the spring contacts extend out through the top housing side and the bottom ends of the spring contacts extend out through the bottom housing side. The middle portion of each spring contact includes a connector which movably connects the middle portion of the spring contact to the passage for the spring contact such that the spring contact is movable along the x, y, and z axes. The top and bottom ends of each spring contact include one of a solder sphere and a solder pad. |
