发明名称 LED LAMP
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED lamp mounted with a side emission LED package, in which the durability of a circuit component is made sufficient and trouble due to thermal expansion is reduced. <P>SOLUTION: Fig. 1 shows a cross section of the structure of the LED lamp 10 of the invention. On an end 11a of a flexible printed board 11 in a beltlike rectangular shape, the side emission LED package 12, a Zener diode 13, and a resistor 14 are mounted apart from one another. The Zener diode 13 and resistor 14 are covered with a housing 15, and the gap formed with the housing 15 is filled with a sealing resin 18. Further, the side emission LED package 12 is sealed in a hollow state with the housing 15 and a translucent plate 16. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009129928(A) 申请公布日期 2009.06.11
申请号 JP20070299740 申请日期 2007.11.19
申请人 TOYODA GOSEI CO LTD 发明人 NARITA TAKUMI;KAMIYA TAKAYUKI
分类号 H01L33/56;H01L33/58;H01L33/62;H01L33/64 主分类号 H01L33/56
代理机构 代理人
主权项
地址