摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED lamp mounted with a side emission LED package, in which the durability of a circuit component is made sufficient and trouble due to thermal expansion is reduced. <P>SOLUTION: Fig. 1 shows a cross section of the structure of the LED lamp 10 of the invention. On an end 11a of a flexible printed board 11 in a beltlike rectangular shape, the side emission LED package 12, a Zener diode 13, and a resistor 14 are mounted apart from one another. The Zener diode 13 and resistor 14 are covered with a housing 15, and the gap formed with the housing 15 is filled with a sealing resin 18. Further, the side emission LED package 12 is sealed in a hollow state with the housing 15 and a translucent plate 16. <P>COPYRIGHT: (C)2009,JPO&INPIT |