| 摘要 |
A release resin composition that is excellent in thermal stability, for example, during extrusion molding and does not cause problems such as smoking and foaming during preparation of a compound product or extrusion molding and further does not contaminate metal rollers. The release resin composition can be formed into a release layer that does not cause migration of impurities to an adhesive layer being in direct contact with the release layer and therefore does not decrease the adhesive properties of the adhesive layer. The release resin composition includes a release agent (A) of which main component is a polymer compound having a weight average molecular weight of 10000 to 1000000 and containing an aliphatic group having 8 to 30 carbon atoms and includes a thermoplastic polymer (B) containing an olefin monomer and/or a polar monomer as a constitutional unit, wherein the amount of the release agent (A) is 0.1 to 20 parts by weight to 100 parts by weight of the thermoplastic polymer (B). The release agent (A) shows a 2% weight loss temperature in the range of 260° C. or higher but lower than 275° C. and a 5% weight loss temperature in the range of 275° C. or higher but lower than 330° C. in thermogravimetric analysis. |
