| 摘要 |
Example embodiments of a semiconductor package are provided. In accordance with an example embodiment, a semiconductor package may include an external terminal connected to a concave surface of a bottom pad, wherein the bottom pad is recessed into a substrate. In accordance with another example embodiment, a semiconductor package may include at least one external terminal, a flexible substrate having a first surface with a plurality of convex portions and a second surface opposite the first surface having a plurality of concave portions, wherein the at least one terminal is recessed into the substrate and at least one of the concave portions surrounds a portion of the at least one external terminal.
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