| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus for laser cutting of a glass substrate whose laser cutting head itself moves. <P>SOLUTION: The apparatus for laser cutting of a glass substrate, includes a cutting table (120) for holding a glass substrate in the horizontal state, a biaxial gantry stage (50) for moving a gantry structure (60) along the cutting table (120), a gantry structure (60) which is provided vertically at an upper part of the biaxial gantry stage (50) and which moves along the gantry stage (50), a laser oscillating part (100) which is provided fixedly at the both ends of the gantry structure (60) and which oscillates a laser, and a laser irradiating head (110) which is so equipped as to be able to move right and left at the both ends of the above gantry structure (60) and which irradiates the laser that is oscillated from the above laser oscillating part (100), on a glass substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
