| 摘要 |
PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing aqueous dispersant for polishing a wiring layer composed of cooper or copper alloy prepared on an organic resin insulating substrate which is capable of polishing a metal film uniformly and stably with a low friction as well as a high polishing rate and a high planarization performance without causing a defect in the metal film and an insulating film, which reduces the remaining Cu after polishing and provides excellent in the polish selectivity for Cu films. SOLUTION: An objective is achieved by the method of polishing a wiring layer containing copper or copper alloy prepared on an organic resin insulating substrate comprising the first polishing step of polishing the wiring layer containing cooper or copper alloy prepared on the organic resin insulating substrate using a chemical mechanical polishing aqueous dispersant and the second polishing step of polishing the wiring layer using a chemical mechanical polishing aqueous dispersant different from the chemical mechanical polishing aqueous dispersant used in the first polishing step. COPYRIGHT: (C)2009,JPO&INPIT |
