发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To solve a problem that it is difficult to form a desired slit shape with a shape of a blade of a punching die corresponding to a slit end roughening in a process with the punching die for a slit of such narrow width around 200 &mu;m as required for the slit to be formed in an antenna part for input-output separation of an RFID chip for use that tends to be also miniaturized for overall size reduction because of recent demand for miniaturization. <P>SOLUTION: In manufacture of an electronic tag, when an aluminum-based tape-like thin film is punched with a die to form an antenna part, relatively wide first and second apertures are first formed by punching with first and second dies, then a third aperture is formed between the first and second apertures by punching with a third die so as to be connected with both of the first and second apertures at its relatively narrow parts. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009129144(A) 申请公布日期 2009.06.11
申请号 JP20070302575 申请日期 2007.11.22
申请人 RENESAS TECHNOLOGY CORP 发明人 JIN TAKAHARU
分类号 G06K19/077;G06K19/07 主分类号 G06K19/077
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