| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component module satisfying both high integration and stabilization of electrical characteristics. SOLUTION: In the electronic component module, a ferrite substrate 28, a ferrite resin layer 20 containing a winding 22 and resin layers 52 and 54 containing an IC 53 are laminated. The ferrite substrate 28 is protruded from the surface into the ferrite resin layer 20 and includes a first protrusion part 29 of ferrite. The wire 22 is disposed around the first protrusion part 29 in the ferrite resin layer 20. The IC 53 superimposes on the first protrusion part 29 in the resin layers 52 and 54. This allows high integration. The IC 53 is disposed on a site where the first protrusion part 29 of ferrite small in height fluctuation due to thermal expansion, and the ferrite resin layer 20 thin in thickness in the first protrusion part 29 and small in thickness change amount of thermal expansion are superimposed. A gap change amount between the winding 22 and the IC 53 by thermal expansion is made small. The electrical characteristics are more stabled. COPYRIGHT: (C)2009,JPO&INPIT
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