| 摘要 |
A photoelectric conversion element unit for use in an imaging apparatus including a photoelectric conversion element package containing a photoelectric conversion element, a wiring substrate where the photoelectric conversion element package is mounted on the first surface and an electronic component related to the photoelectric conversion element is mounted on a rear side of the first surface, and a support board attached to an attachment point in the imaging apparatus where the photoelectric conversion element package is fixed, wherein an opening smaller than an external form of the photoelectric conversion element package is formed in the support board, and the electronic component mounted on the wiring substrate is provided within the opening.
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