| 摘要 |
<p>An apparatus for pressure-bonding a component is provided with a plurality of pressure-bonding units, which respectively have pressure-bonding heads for pressure-bonding components in substrate regions wherein the components are to be pressure-bonded, and end section supporting members for supporting end portions of a substrate, and the pressure-bonding units are arranged in a row. The apparatus is also provided with a guiding/supporting member, which guides a shift in a direction along the end portion where substrate bonding is to be performed and supports each pressure-bonding unit; a common head lifting apparatus for integrally bringing up and down each pressure-bonding head; and a plurality of unit transfer apparatuses, which are arranged for the pressure-bonding units, respectively, shift the pressure-bonding units along the end portion and change the arrangement of the pressure-bonding units.</p> |
