| 摘要 |
<P>PROBLEM TO BE SOLVED: To polish and remove an extra conductive film while preventing the occurrence of erosion and without lowering the throughput. <P>SOLUTION: A polishing apparatus includes: a polishing table 100 having a polishing surface; a top ring 10 for holding a workpiece to be polished having a surface conductive film 6, and slidably pressing the conductive film 6 against the polishing surface to polish the conductive film 6; an optical sensor 130 for monitoring the polishing state of the conductive film 6 by emitting light toward the conductive film 6 of the workpiece held by the top ring 10, receiving reflected light from the conductive film 6, and measuring a change in the reflectance in the reflected light; and a control section 132 for controlling a pressure at which the workpiece is pressed on the polishing surface. <P>COPYRIGHT: (C)2009,JPO&INPIT |
