| 摘要 |
<p>A connection structure for a printed wiring board which enables high density integration is provided. A FCP 2 includes an exposed conductor part 2 A including an insulating substrate 22 and a reinforcing plate 24 stacked with this substrate 22 via an elastic member 23 . In the exposed conductor part 2 A, conductors 21 each having a protrusion 20 formed on a surface is placed on the insulating substrate. The exposed conductor part 2 A can be elastically deformed in the thickness direction in which the substrate 22 , the reinforcing plate 24 and the like are stacked. A printed wiring board 1 is constructed by stacking an inner layer board 10 and a first outer layer board 11 and a second outer layer board 12 which sandwich this inner layer board 10 . A notched groove 10 A is formed on the inner layer board 10 , and an insertion opening 10 B is formed. Through-hole ports 11 which appear on the notched groove 10 A side is placed on the first outer layer board. When the FPC 2 is inserted into the insertion opening 10 B, the protrusion 20 of the FPC 2 fits with the through-hole port 11 A from within insertion opening 10 B and presses thereto.</p> |
