发明名称 |
Apparatus and method for observing defects in semiconductor wafers |
摘要 |
Imprecisely located defects are imaged by milling a series of slices and performing a light, preferential etch to provide a topographical interface between materials having similar secondary electron emission characteristics. The slices are sufficiently small to capture small defects, but are sufficiently large to overcome problems with redeposition. |
申请公布号 |
EP2068160(A2) |
申请公布日期 |
2009.06.10 |
申请号 |
EP20080170761 |
申请日期 |
2008.12.05 |
申请人 |
FEI COMPANY |
发明人 |
BRAY, MATTHEW;CASTAGNA, MARC |
分类号 |
G01R31/307;G01N1/00;H01J37/26;H01J37/304;H01J37/305;H01L21/66 |
主分类号 |
G01R31/307 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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