发明名称 |
ELECTROLESS PLATING METHOD |
摘要 |
This invention provides an electroless plating method comprising electrolessly plating the surface of a metal base sample using a supercritical fluid or a subcritical fluid in such a state that a metal powder is dispersed in an electroless plating liquid. According to this method, a homogeneous and thick plating layer is formed in a short time by taking advantage of an induction eutectoid phenomenon. In the electroless plating method, the metal powder may have an average particle diameter of not less than 1 nm and not more than 100 &mgr;m, and the electroless plating method may also be applied to a damascene process or a dual damascene process which is a method for forming a fine metal wiring within a semiconductor element. The above constitution can provide an electroless plating method which can realize the formation of an even film by electroless plating in a short time using a subcritical fluid or a supercritical fluid by taking advantage of an induction eutectoid phenomenon.
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申请公布号 |
EP2067880(A1) |
申请公布日期 |
2009.06.10 |
申请号 |
EP20070830426 |
申请日期 |
2007.10.24 |
申请人 |
S.E.S. COMPANY LIMITED;MIYATA, SEIZO |
发明人 |
MIYATA, SEIZO;SHIMIZU, TETSUYA;TAJIMA, HISAYOSHI;SONE, MASATO |
分类号 |
C23C18/31;H01L21/288 |
主分类号 |
C23C18/31 |
代理机构 |
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地址 |
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