| 摘要 |
In a method of manufacturing a wiring substrate according to the present invention, a metal foil is tentatively fixed onto a temporary substrate, which is made of a nonwoven fabric impregnated with resin, by selectively attaching a peripheral side of the metal foil to an outer peripheral portion of a wiring formation region of the temporary substrate, thereafter, a build-up wiring layer is formed on the metal foil, and the metal foil is separated from the temporary substrate by cutting out an inside portion of a structure, the portion being inward from the adhesive layer, in this way, a wiring member including the build-up wiring layer formed on the metal foil is obtained.
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