发明名称 |
Low cost power semiconductor module without substrate |
摘要 |
A power module for low voltage applications, which does not include an insulated metal substrate is disclosed. The module includes a power shell and a plurality of lead frames each lead frame including a conductive pad on which one or more MOSFETs may be electrically mounted. The MOSFETs are electrically connected via wire bonds.
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申请公布号 |
US7545033(B2) |
申请公布日期 |
2009.06.09 |
申请号 |
US20060495107 |
申请日期 |
2006.07.28 |
申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
GRANT WILLIAM |
分类号 |
H01L23/10;H01L25/07;H01L23/34;H01L25/16;H01L25/18;H02M7/00 |
主分类号 |
H01L23/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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