发明名称 HEAT SINK DEVICE
摘要 A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on a side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5. The stress relaxation member 4 is formed of an aluminum plate 10 having a plurality of through holes 9 formed therein, and the through holes 9 serve as stress-absorbing spaces. The stress relaxation member 4 is brazed to the metal layer 7 of the insulating substrate 3 and to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.
申请公布号 US2009139704(A1) 申请公布日期 2009.06.04
申请号 US20060910460 申请日期 2006.04.06
申请人 KABUSHIKI KAISHA TOYOTA JIDOSHOKKI;SHOWA DENKO K.K. 发明人 OTOSHI KOTA;KONO EIJI;KUBO HIDEHITO;KIMBARA MASAHIKO;FURUKAWA YUICHI;YAMAUCHI SHINOBU;HOSHINO RYOICHI;WAKABAYASHI NOBUHIRO;NAKAGAWA SHINTARO
分类号 F28F7/00 主分类号 F28F7/00
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