| 摘要 |
PROBLEM TO BE SOLVED: To realize a semiconductor chip which is manufactured by a manufacturing method including a cutting process by a dicing process using laser light and can prevent a fine piece of a reformed region from peeling from a cut surface of the semiconductor chip, and its manufacturing method. SOLUTION: In a reformed region formation process, a cutting predetermined line DL is set along a (111) surface forming an angle of 54.7°from a substrate surface 21a which is a (100) surface. A laser head 31 is scanned along the cutting predetermined line DL and a plurality of reformed regions K are formed arranged on the cutting predetermined line DL. Since the reformed region K is formed along a (111) surface which is a cleavage surface, a wafer 20 can be cut by a relatively small force in a following cutting process. Accordingly, excessive stress is not loaded on the reformed region K, thus enabling a semiconductor chip 22 to be manufactured while restraining generation of fine pieces. COPYRIGHT: (C)2009,JPO&INPIT
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