METHOD OF REPAIRING DEFECTS OF WIRING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of repairing defects of a wiring substrate capable of repairing a missing part of a wiring pattern to planar without a prominence and easily. SOLUTION: This repairing method includes: detecting a missing part 34 of a wiring pattern 32 and a missing amount thereof; and preparing a paste in an amount corresponding to the missing amount and applying the paste to the wiring substrate through a dispenser 36 to cure the paste. COPYRIGHT: (C)2009,JPO&INPIT