| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having such a structure that the reliability does not decrease even when the structure is made more compact. <P>SOLUTION: The semiconductor device comprises a semiconductor substrate 1 having an electrode pad 4, a rewiring layer 6 having an electricity feeding portion which feeds electricity to the electric pad 4, a conductor post 7, a sealing resin 8 supporting the conductor post 7 from its periphery, and an external electrode 9 formed at the top face of the conductor post 7. While the conductor post 7 is electrically connected to the electricity feeding portion on the rewiring layer 6, its reverse bottom surface covers the whole electrode pad 4. Consequently, stress to the electrode pad 4 becomes uniform to prevent the rewiring layer 6 right above the electrode pad 4 from deteriorating. <P>COPYRIGHT: (C)2009,JPO&INPIT |
