发明名称 ANNULAR PLATING BATH
摘要 PROBLEM TO BE SOLVED: To provide a plating bath capable of forming a uniform plating layer on the whole surface of a substrate. SOLUTION: The plating bath 100 has a cylindrical housing part housing a plating liquid 111 inside and having an opened upper part and a rotary shaft 110 extended vertically and attached to the center through the plating bath 100. A substrate fixing frame 120 having circular plane external form is attached to the rotary shaft 110 and a substrate fixing tool 121 arranged to make circular along the substrate fixing frame 120 and extended in the vertical direction is attached to the substrate fixing frame 120. The substrate 200 to be plated is attached to the substrate fixing tool 121 to be fixed at the upper and lower end part and a plurality of substrates 200 are arranged to form a circular shape to be immersed in the plating liquid 111. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009120935(A) 申请公布日期 2009.06.04
申请号 JP20080050813 申请日期 2008.02.29
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 LEE JIN UK;YOON HEE SOO;CHOI CHANG HWAN
分类号 C25D17/00;C25D17/08;C25D21/00;C25D21/10 主分类号 C25D17/00
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