| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus which improves the reliability of a plated film and can produce a plated product of high quality, by giving uniform thickness to a plated film. SOLUTION: The plating apparatus for collectively plating a plurality of substrates includes: a plating tank 12 into which a plurality of the substrates 28 are charged; anodes 18 which are connected with the plurality of the substrates 28 respectively so as to face to each other; and separate partition walls 20 for sectioning a plating tank 18 so that a plurality of the substrates 28 are isolated. Then, a plurality of the substrates 28 are each independently plated in independent plating regions, and metal ions liberated from the anode 18 are prevented from arriving at the substrate 28 which faces to the anode 18 adjacent to the above anode 18. COPYRIGHT: (C)2009,JPO&INPIT
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