| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition excellent in the adhesion with hardly adherable elements. SOLUTION: The one-pack moisture-curable resin composition comprises an isocyanate compound (A) of a structure, wherein a secondary carbon or a tertiary carbon is bonded to all isocyanate (NCO) groups in a molecule, ketimine (B) having a ketimine (C=N) bond introduced from ketone or aldehyde and amine and of a structure wherein a branch carbon or a ring member carbon is bonded at anαposition of at least one of ketimine carbon or nitrogen, calcium carbonate (C) surface-treated with a urethane compound, N-silylamide compound (D) having a functional group represented by formula -CONH-Si≡, and a chlorinated polymer (E). COPYRIGHT: (C)2009,JPO&INPIT
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