发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which can control the rotation position of the &theta; axis with high accuracy without providing an encoder for full-closed loop control on the nozzle side. <P>SOLUTION: The electronic component mounting apparatus for mounting an electronic component held by a nozzle at an electronic component supply section onto a substrate includes a nozzle 17a which is free to pivot about the axis, a &theta;-axis motor 19a for pivoting the nozzle, and a belt 19e for transmitting the driving force of the &theta;-axis motor to the nozzle. The electronic component mounting apparatus is equipped with a belt mark 19f attached to the belt, a belt mark detection sensor 19g for detecting the belt mark, and a means for correcting the deviation in rotation position of the nozzle and the &theta;-axis motor with the output of the belt mark detection sensor as a reference. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009124083(A) 申请公布日期 2009.06.04
申请号 JP20070299443 申请日期 2007.11.19
申请人 JUKI CORP 发明人 TAKAHASHI DAISUKE
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
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