| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for a heat-resistant substrate with high connection reliability not generating a crack on a soldered portion even when repeated stress is applied to the soldered connection part by heat and vibration, a prepreg and a heat-resistant substrate. SOLUTION: The resin composition for the heat-resistant substrate contains a methoxynaphthalene-modified epoxy resin, a triazine-modified novolac resin and an inorganic filler, wherein the content of the triazine-modified novolac resin is 40-70 pts.wt., both inclusive, relative to 100 pts.wt. of the methoxynaphthalene-modified epoxy resin, and the resin composition for the heat-resistant substrate has a thermal expansion coefficient of 15-40 ppm at -25 to 125°C. COPYRIGHT: (C)2009,JPO&INPIT
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