发明名称 METHOD AND DEVICE FOR INSPECTING DEFECT OF CONDUCTOR PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a method and device for inspecting a conductor pattern that dispense with acquisition of the whole substrate image, capable of detecting a defective spot on the transparent conductor pattern in a short time. SOLUTION: A probe 15a is connected to each left end of odd-numbered conductor patterns 31, and a probe 15b is connected to each right end of even-numbered conductor patterns 31, and a prescribed voltage is applied between the probes 15a, 15b. When some conductor pattern 31 has a short circuit defect, a current flows through the conductor pattern 31 to generate heat. An infrared camera 12 is moved in a direction perpendicular to the conductor patterns 31, to thereby detect a heat-generating conductor pattern 31. Then, the infrared camera 31 is moved along the heat-generating conductor pattern 31, to thereby detect a heat-generating spot of a part out of a straight line, and the position is stored as a short circuit spot. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009121894(A) 申请公布日期 2009.06.04
申请号 JP20070295008 申请日期 2007.11.14
申请人 FUJITSU LTD 发明人 TADAKI SHINJI
分类号 G01N21/956;G01M11/00;G02F1/13 主分类号 G01N21/956
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