| 摘要 |
PROBLEM TO BE SOLVED: To provide an etchant which gives little load to the environment and shows excellent both effects of inhibiting wires of a conductor circuit from being thinned and inhibiting the under-cut, and to provide a method for manufacturing a wiring board by using the etchant. SOLUTION: The etchant is used for a semi-additive processing method, and includes an oxidizing agent, an acid, a surface active agent and a lipophilic hydrocarbon. The method for manufacturing the wiring board includes using the etchant. COPYRIGHT: (C)2009,JPO&INPIT
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