发明名称 HIGH ELASTIC MODULUS COPPER-CLAD LAMINATE OF THERMOSETTING RESIN-IMPREGNATED GLASS FABRIC BASE MATERIAL AND DRILLING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a copper-clad laminate which has a high elastic modulus and is high in quality at through-holes and via holes by carbon dioxide laser drilling. <P>SOLUTION: In the high elastic modulus copper-clad laminate of a thermosetting resin-impregnated glass fabric base material for laser drilling and the method of drilling laminate holes of a diameter of≤0.15 mm are formed by lasers through a copper-clad laminate having at least one copper foil layer which is laminated on a prepreg obtained by impregnating a thermosetting resin in a glass fabric base material of a thickness of 25-150μm, the weight of 15-165 g/m<SP>2</SP>and an air permeability of 1-20 cm<SP>3</SP>/cm<SP>2</SP>/sec and drying the base material. The laminate allows the formation of through-holes and the via holes at a high speed. The obtained copper-clad laminate has holes with smooth walls and excellent reliability in connection between inner copper foil and front and back copper foil. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009119879(A) 申请公布日期 2009.06.04
申请号 JP20090051636 申请日期 2009.03.05
申请人 MITSUBISHI GAS CHEM CO INC 发明人 TAKE MORIO;KANEHARA HIDENORI;IKEGUCHI NOBUYUKI;MOGI MASAKAZU
分类号 B32B15/08;B23K26/00;B23K26/38;B32B17/04;H05K1/03;H05K3/00 主分类号 B32B15/08
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