| 摘要 |
This invention relates to a method for protecting, by a tape, a wafer circuit surface provided with high bumps, and a method for reducing wafer thickness. In order to solve a problem of a quality deterioration of a wafer of which the backside has been polished, and a problem of troublesome work attributable to the adoption of a multilayer structure, the following means is adopted. A resin layer (2) is provided on a wafer (1) in its circuit surface (1-1) provided with high bumps (100), so that the high bumps (100) in their skirts (100A) are filled with the resin layer (2). Protective tapes (3, 3-1) are applied onto the resin layer (2) to protect the wafer circuit surface (1-1). Thereafter, the wafer (1) on its backside (1-2) is polished to reduce the thickness of the wafer (1).
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