发明名称 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
摘要 Disclosed is a substrate treatment method intended for a substrate having, on its surface, a composite product of an inorganic material containing silicon oxide and an organic material containing carbon and fluorine. The method comprises: an ultraviolet ray treatment step for irradiating the surface of the substrate with ultraviolet ray to remove a part of the organic material; a hydrogen fluoride treatment step which is conducted after the ultraviolet ray treatment step and which is for supplying a steam of hydrogen fluoride onto the surface of the substrate to remove at least a part of the inorganic material; and a heating treatment step which is conducted after the ultraviolet ray treatment step and which is for heating the substrate to cause the shrinkage of a part of the organic material that remains unremoved.
申请公布号 KR20090057065(A) 申请公布日期 2009.06.03
申请号 KR20097006322 申请日期 2007.10.01
申请人 TOKYO ELECTRON LIMITED 发明人 KAWAMURA SHIGERU;HAYASHI TERUYUKI
分类号 H01L21/302 主分类号 H01L21/302
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