| 摘要 |
A semiconductor package module is provided to improve data storage capacity and processing speed by combining two semiconductor modules with a socket. A semiconductor device module comprises at least two semiconductor modules(100) and a socket(200), and the semiconductor module comprises a semiconductor package(120) arranged in the substrate(110) and on the substrate while including a connection terminal(130) connected with the semiconductor package. A socket comprises an input terminal(220) which is electrically connected with each terminal arranged on the at least semiconductor module, and it also includes a combination output terminal.
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