CARRIER FOR HOLDING UNIT TYPE BOARD

摘要

A carrier for holding a unit type substrate is provided to prevent a substrate warpage by performing a semiconductor package process while a plurality of substrates is inserted in a coupling hole formed in a center of both sides of a receiving frame. A receiving frame(100) is arranged in both sides of a substrate, and holds a plurality of unit type substrates(200). The unit type substrate mounted in the receiving frame is not changed by an external pressure by forming the receiving frame made of metal material of a long stick shape. A coupling hole of a cut shape is formed in both sides of the receiving frame, and receives the unit type substrate. A top part and a bottom part of an inner surface of the coupling hole have a tilt surface.