| 摘要 |
A semiconductor package is provided to improve the electrical signal performance while maintaining the stable handling of a substrate and the mechanical stability by inserting and fusing a solder ball from the bottom of the substrate. A substrate(101) includes a conductive circuit pattern(104) etched and formed with the predetermined circuit arrangement in the upper side. A through hole(106) passes through the conductive circuit pattern from the bottom of a resin layer(102) of the substrate. A wire(110) connects a bonding pad of the semiconductor chip and the conductive circuit pattern exposed to the upper side. A molding compound resin(112) is molded in a molding region on the substrate to protect the semiconductor chip and the wire. A non-conductive supporter(116) is attached to the bottom of the substrate by the attaching unit. A solder ball(120) is inserted into a coupling hole of the non-conductive supporter.
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