| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding wheel capable of increasing grinding speed, eliminating replacement of a grinding wheel during grinding, achieveing high quality of a surface after the completion of grinding, and simplifying a polishing process. SOLUTION: The grinding wheel grinds a backside of a wafer 12 for electronic material to a target thickness, and includes a plurality of phases of annular grinding surfaces. A diamond abrasive grain is fixed in the each phase from an external phase to an internal phase with various bonding material, and glass series bonding material is used as the bonding material of the diamond abrasive grain at the outermost phase. Besides, resin series bonding material is used at the internal phases excepting the outermost phase. The diamond abrasive grains of which diameters shown in the standard chart are identical are used, thus obtaining optimum characteristics for grinding the backside of the wafer 12. COPYRIGHT: (C)2009,JPO&INPIT
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