| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a non-contact IC card which can manufacture a high quality non-contact IC card at low cost even when a front side substrate and a back side substrate are cut into sheets. <P>SOLUTION: The method for manufacturing a non-contact IC card 1 initially prepares a front side substrate 2 including a first substrate 3 and a first hot melt layer 4; a back side substrate 5 including a second substrate 6 and a second hot melt layer 7; and an inlet sheet 8 including a base material 9 for an inlet, an IC chip 11 and an antenna 10. Next, the first hot melt layer 4 and the second hot melt layer 7 are dried to harden. Next, an IC card laminated body 12 in which the inlet sheet 8 is interposed between the front side substrate 2 and the back side substrate 5 is made and temporarily joined. Subsequently, the front side substrate 2 and the back side substrate 5 are adhered to the inlet sheet 8 by melting the first hot melt layer 4 and the second hot melt layer 7 between one or more pairs of heating rollers 27. <P>COPYRIGHT: (C)2009,JPO&INPIT |
