发明名称 METHOD AND APPARATUS FOR FORMING SILICON DOTS
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus which form silicon dots that have uniform particle sizes and exhibit a uniform density distribution, directly on a substrate at low temperature. SOLUTION: In a hydrogen gas is supplied into a chamber 1, provided with a silicon sputter target 30 and a substrate S. A high-frequency power is applied to the gas in the chamber 1 so that plasma is generated, such that a ratio [Si(288 nm)/Hβ] between the emission intensity Si (288 nm) of silicon atoms at a wavelength of 288 nm and the emission intensity Hβof hydrogen atoms, at a wavelength of 484 nm in plasma emission is 10.0 or lower in a plasma light emission. Silicon dots having particle sizes of 20 nm or lower are formed directly on the substrate at a lower temperature of 500°C or lower by subjecting the target 30 to a chemical sputtering of the target 30 by the plasma. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009117849(A) 申请公布日期 2009.05.28
申请号 JP20080310134 申请日期 2008.12.04
申请人 NISSIN ELECTRIC CO LTD 发明人 TAKAHASHI EIJI;MIKAMI TAKASHI;KISHIDA SHIGEAKI;KATO KENJI;TOMYO ATSUSHI;HAYASHI TSUKASA;OGATA KIYOSHI
分类号 H01L21/203;C23C14/14;C23C16/24;H01L21/205;H01L21/8247;H01L27/10;H01L27/115;H01L29/06;H01L29/66;H01L29/788;H01L29/792 主分类号 H01L21/203
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