| 摘要 |
PROBLEM TO BE SOLVED: To estimate an electric property of a semiconductor package with high accuracy as considering cost. SOLUTION: This electric property estimation device acquires information related to a configuration of a PKG (semiconductor package), specifies substrate cost and assembly cost from the acquired information related to the configuration of the PKG, and calculates cost of the PKG. The electric property estimation device acquires wire length information of the PKG from design information, specifies an electromagnetic field analysis simulation result according to the wire length information as an electric property value of a wire portion of the PKG, similarly acquires interposer wiring length information of the PKG from the design information, specifies an electromagnetic field analysis simulation result according to the interposer wiring length information as an electric property value of an interposer portion of the PKG, and outputs them together with a cost calculation result. COPYRIGHT: (C)2009,JPO&INPIT
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