发明名称 DOUBLE-SIDED WIRING BOARD, MANUFACTURING METHOD OF DOUBLE-SIDED WIRING BOARD, AND MOUNTING DOUBLE-SIDED WIRING BOARD
摘要 In one embodiment of the present invention, a connecting device of a double-sided wiring board includes a first-side connecting land portion configured by a first-side conductive layer and a first-side connecting conductive layer and a second-side connecting land portion configured by a second-side conductive layer; the first-side connecting land portion and the second-side connecting land portion face each other at respective central portions with an insulating substrate sandwiched therebetween; a substrate hole is formed corresponding to a peripheral end portion of the first-side connecting land portion and a peripheral end portion of the second-side connecting land portion; and the peripheral end portion of the first-side connecting land portion and the peripheral end portion of the second-side connecting land portion are connected to each other via the substrate hole.
申请公布号 US2009133918(A1) 申请公布日期 2009.05.28
申请号 US20080193492 申请日期 2008.08.18
申请人 KASHIO HITOSHI 发明人 KASHIO HITOSHI
分类号 H05K1/11;H01B13/00 主分类号 H05K1/11
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