INTEGRATED CIRCUIT DIE STRUCTURE SIMPLIFYING IC TESTING AND TESTING METHOD THEREOF

摘要

By adding multiplexing units to selectively transmit signals associated with a functional circuitry of an IC die to test pads, a probe card with less pin counts than the pad number of the IC die can be utilized for testing the functional circuitry. Therefore, the pad number/pad pitch of the IC die is not limited by the pitch of the conventional probe card. A high pin count IC die design is thereby available.