| 摘要 |
Disclosed herewith is a semiconductor module manufacturing apparatus capable of reducing occurrence of warping of the wiring substrate, etc., as well as occurrence of failures of bonding between the wiring substrate and semiconductor chips, etc. without lowering the productivity. The semiconductor module manufacturing apparatus employs a batch reflowing process that heats one, two, or more wiring substrates and at least two or more semiconductor chips or semiconductor devices simultaneously. After the heating process, the semiconductor chips or semiconductor devices are heated and bonded on the wiring substrate. The apparatus includes at least a stage for chucking the wiring substrate fixedly; a heat source for heating the semiconductor chips or semiconductor devices out of contact therewith; and a controller for controlling the heating value of the heat source.
|
