| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin-sealed electronic component apparatus capable of preventing peeling between a circuit board and a molding resin. <P>SOLUTION: The resin-sealed electronic component apparatus 10 includes a resin-made circuit board 12 having an electronic component 14 mounted thereon, a lead frame 18 having the circuit board 12 placed thereon, and a molding resin 24 for integrally sealing the circuit board and the lead frame. In the apparatus 10, the circuit board 12 includes a resin filling portion 30 formed along a plate thickness direction and having a step difference portion 32 facing the lead frame 18 side in an intermediate portion of the plate thickness direction, and a part 26 of the molding resin 24 is filled in the resin filling portion 30. According to this configuration, since the adhesiveness between the circuit board 12 and the molding resin 24 can be improved, and this can prevent peeling the circuit board 12 from the molding resin 24 even if a stress S is applied to the molding resin 24. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
