| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a light emitting diode device with a heat sink base. <P>SOLUTION: The light emitting diode device includes a light emitting diode chip and the heat sink base made of a material with a high thermal conductivity coefficient and integrally connected to the light emitting diode chip. The heat sink holder includes a base in direct contact with the light emitting diode chip, a central portion for leading out heat from the light emitting diode chip, and a reflecting portion surrounding the central portion, wherein its normal of the top surface forms an acute angle relative to a normal of the top surface of the central portion and light emitted by the light emitting diode chip is reflected forward and upward. Thus, the device is made to dissipate the heat at high speed, a working duration is extended, the light emission of the device is concentrated and luminance is increased. <P>COPYRIGHT: (C)2009,JPO&INPIT |
