| 摘要 |
A chip packaging process integrates a burn-in test or a high temperature test to simplify overall packaging and testing process flow. One or more chips are disposed on one or more units of a substrate strip where the substrate strip has a plurality of electrical open sections at the plating lines to electrically isolate the external pads between different units. After electrical connection and encapsulation, a burn-in test is executed at the same time of a post mold curing step, with a high-temperature testing if necessary. Therefore, the chips on the substrate strip has been gone through the burn-in test during the encapsulant is completely cured at the post mold curing step and the burn-in test is finished before the singulation step to reduce the overall testing time.
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