METHOD AND APPARATUS FOR COUPLING AND DECOUPLING A DEVICE AND A HEAT PIPE

摘要

The present invention provides a method and apparatus for coupling a device to a heat pipe, wherein a heat transformable material is placed at the location on the heat pipe at which the device is to be coupled. The device is positioned relative to this location and in contact with the heat transformable material and subsequent heat is applied to the end of the heat pipe opposite the coupling location. The external heat which is applied to the heat pipe is transferred along the heat pipe to the proximity of the coupling location. The heat transformable material undergoes a change due to the application of heat and mates the device with the heat pipe. The heat transformable material changes into a substantially solid state upon the removal of the external heat source, thereby coupling the device to the heat pipe.