| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a capacitor sheet integrated into a board wherein a thin large electrostatic capacity can be obtained and the capacity can be altered easily; to provide an element integrating board integrating the capacitor sheet thereinto. <P>SOLUTION: In the capacitor sheet, there are used a plurality of laminated dielectric sheets on a single surface of each of which a plurality of blocked inner-layer electrodes are formed and wherein the inner-layer electrode of each dielectric sheet has the portions overlapping with no inner-layer electrodes of its upper-side and lower-side dielectric sheets. Further, in the capacitor sheet, the electric connections among its outermost-layer electrodes and its inner-layer electrodes are performed by through holes similarly to the manufacturing process of a general printed wiring board. The design of the electrostatic capacity of a capacitor element using this capacitor sheet can be altered easily. Also, when these capacitor sheets are laminated as the capacitor layer of a general printed wiring board, the plurality of capacitor elements can be so integrated at the same time into the printed wiring board as to make obtainable a high-performance thin board integrating the elements thereinto. <P>COPYRIGHT: (C)2004,JPO</p> |
