PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound with an ethylenic unsaturated bond, and (C) a photopolymerization initiator, wherein component (B) includes a photopolymerizing compound with an organic group represented by the following general formula (1).
In the formula, R 1 and R 2 each independently represent hydrogen or a methyl group, L 1 and L 2 each independently represent a C1-6 alkylene group and m and n each independently represent an integer of 0-50 selected so that the total of m and n is 0-50.