ELECTRONIC COMPONENTS MOUNTING ADHESIVE, MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTING ADHESIVE, ELECTRONIC COMPONENTS MOUNTED STRUCTURE, AND MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTED STRUCTURE

摘要

An object is to provide an electronic components mounting adhesive capable of lowering the probability of occurrence of short-circuiting and increasing the reliability of the joining of electrodes in an electronic components mounted structure obtained by bonding electronic components to each other, as well as a manufacturing method of such an electronic components mounting adhesive, a resulting electronic component mounted structure, and a manufacturing method of such an electronic component mounted structure. In an electronic components mounted structure 10, a first circuit board 11 and a second circuit board 13 are bonded to each other with an electronic components mounting adhesive 20. The electronic components mounting adhesive 20 is such that solder particles 22 are dispersed in a thermosetting resin 21. The solder particles 22 are subjected to heating treatment in an oxygen-containing atmosphere before being dispersed in the thermosetting resin 21. Electrodes 12 of the first circuit board 11 and electrodes 14 of the second circuit board 13 are electrically connected to each other by solder particles 22 that are sandwiched between the electrodes 12 and 14 and their surface oxide films 22a are thereby broken.